Products/Industrial Electronics/IoT & Telecommunications

Industrial Electronics · IoT & Telecommunications

IoT & Telecommunications manufacturing

INDIC supports IoT and telecommunications electronics across smart-city lighting modules, HDI vision and sensing boards, RF modules and telecom infrastructure cards, with fine-pitch PCBA, test and integration capabilities.

6product families
HDI / RF PCBAmanufacturing scope
IPC Class 2capability tags

Product portfolio

IoT & Telecommunications product families

Each family below lists the build scope INDIC has delivered for it.

01 · PRODUCT FAMILY

Smart Street-Lighting PCBAs

INDIC has build experience in Smart Street-Lighting PCBAs for connected, intelligent street-lighting modules (e.g. four-board Printed Circuit Board Assembly configurations).

Smart Street-Lighting PCBAsPCBARoHS / IPC Class 2

Build scope

  • PCB assembly (SMT / THT) with inline inspection
  • Multi-board module assembly
  • Electrical and functional test as defined by the program
  • Unit-level traceability
Does INDIC manufacture Smart Street-Lighting PCBAs?

Yes. Smart Street-Lighting PCBAs are part of INDIC's portfolio, built as PCBA.

What is the build scope?

PCB assembly (SMT / THT) with inline inspection; Multi-board module assembly; Electrical and functional test as defined by the program, with unit-level traceability.

02 · PRODUCT FAMILY

Camera Module PCBAs (HDI)

INDIC has build experience in Camera Module PCBAs (HDI) for embedded imaging for smart-edge and vision-based devices.

Camera Module PCBAsPCBARoHS / IPC Class 2

Build scope

  • PCB assembly (SMT / THT) with inline inspection
  • High-density interconnect (HDI) board assembly
  • Electrical and functional test as defined by the program
  • Unit-level traceability
Does INDIC manufacture Camera Module PCBAs (HDI)?

Yes. Camera Module PCBAs (HDI) are part of INDIC's portfolio, built as PCBA.

What is the build scope?

PCB assembly (SMT / THT) with inline inspection; High-density interconnect (HDI) board assembly; Electrical and functional test as defined by the program, with unit-level traceability.

03 · PRODUCT FAMILY

Motion-Sensing Boards (8-layer HDI)

INDIC has build experience in Motion-Sensing Boards (8-layer HDI) for motion-sensing, gesture, and last-mile imaging applications.

Motion-Sensing BoardsPCBARoHS / IPC Class 2

Build scope

  • PCB assembly (SMT / THT) with inline inspection
  • High-density interconnect (HDI) board assembly
  • Electrical and functional test as defined by the program
  • Unit-level traceability
Does INDIC manufacture Motion-Sensing Boards (8-layer HDI)?

Yes. Motion-Sensing Boards (8-layer HDI) are part of INDIC's portfolio, built as PCBA.

What is the build scope?

PCB assembly (SMT / THT) with inline inspection; High-density interconnect (HDI) board assembly; Electrical and functional test as defined by the program, with unit-level traceability.

04 · PRODUCT FAMILY

RF IoT Modules

INDIC has build experience in RF IoT Modules for wireless Internet of Things (IoT) communication modules (Ball Grid Array (BGA)-dense, Radio Frequency (RF)-sensitive).

RF IoT ModulesPCBARoHS / IPC Class 2

Build scope

  • PCB assembly (SMT / THT) with inline inspection
  • RF-sensitive, fine-pitch module assembly
  • Electrical and functional test as defined by the program
  • Unit-level traceability
Does INDIC manufacture RF IoT Modules?

Yes. RF IoT Modules are part of INDIC's portfolio, built as PCBA.

What is the build scope?

PCB assembly (SMT / THT) with inline inspection; RF-sensitive, fine-pitch module assembly; Electrical and functional test as defined by the program, with unit-level traceability.

05 · PRODUCT FAMILY

VoIP Gateways

INDIC has build experience in VoIP Gateways for internet Protocol (IP)-based telecommunications infrastructure, Session Initiation Protocol (SIP) gateways.

VoIP GatewaysPCBA + Box BuildRoHS / CE

Build scope

  • PCB assembly (SMT / THT) with inline inspection
  • Enclosure integration and box build
  • Electrical and functional test as defined by the program
  • Unit-level traceability
Does INDIC manufacture VoIP Gateways?

Yes. VoIP Gateways are part of INDIC's portfolio, built as PCBA + Box Build.

What is the build scope?

PCB assembly (SMT / THT) with inline inspection; Enclosure integration and box build; Electrical and functional test as defined by the program, with unit-level traceability.

06 · PRODUCT FAMILY

EPABX Cards

INDIC has build experience in EPABX Cards for enterprise Private Branch Exchange (PBX) switching and telephony.

EPABX CardsPCBARoHS / CE

Build scope

  • PCB assembly (SMT / THT) with inline inspection
  • Electrical and functional test as defined by the program
  • Unit-level traceability
Does INDIC manufacture EPABX Cards?

Yes. EPABX Cards are part of INDIC's portfolio, built as PCBA.

What is the build scope?

PCB assembly (SMT / THT) with inline inspection; Electrical and functional test as defined by the program, with unit-level traceability.

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Case studies

Programs delivered in this product family

Published case studies from the INDIC blog that relate to products in this hub.

Scope note: INDIC manufactures and industrializes the customer-defined product. Product architecture, software, calibration and certification ownership are agreed per program.

Underlying services

Services behind IoT & Telecommunications

The Products subsite describes what INDIC has experience manufacturing; the service pages describe the underlying manufacturing, test and integration capabilities.

Discuss an IoT & Telecommunications program?

Share the build stage, assembly scope, test requirements and integration needs with the INDIC team.

Discuss a program

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