IoT & Smart Devices Manufacturing
5
Fine-pitch RF, smart-city PCBAs, vision modules, and connectivity electronics
Connected devices live or die on placement precision. Fine-pitch RF modules with 0.3 mm BGA pitch, multi-board smart-city PCBAs with limited test points, HDI camera and motion-sensing assemblies — all push placement, shielding, and depaneling tolerances to their edge. Indic manufactures IoT and smart-device electronics under a process discipline built specifically for that complexity, with proven outcomes on 0.3 mm pitch, BGA-dense, RF-shielded designs.
1. Connectivity & RF Modules
For connected-device OEMs where RF integrity and fine-pitch placement decide field performance.
Fine-Pitch RF IoT Modules
RF IoT communication modules · BGA-dense layouts down to 0.3 mm pitch and 01005 passives · Shielded packages with controlled stencil and reflow profiles.
Builds: PCBA · Certifications: IPC-A-610 Class 2/3, RoHS
Zigbee Communication Modules & AMI Energy Meters
Zigbee communication modules for wireless mesh networking · Zigbee-enabled Smart Energy Meters (AMI) · Energy Meters for utility billing infrastructure.
Builds: PCBA + Box-Build · Certifications: RoHS, BIS-eligible
BGA-Dense Module Production
Five or more BGAs per board · Type 5 solder paste with redesigned stencils and support blocks · Aperture and rheology tuning for fine-pitch yield.
Builds: PCBA (RF) · Certifications: IPC-A-610 Class 2/3
IN PRACTICE
For a fast-growing IoT customer backed by a leading silicon provider, Indic solved three coupled manufacturing problems— solder paste printing with Type 5 paste and redesigned stencils, component placement stability via package-level pick-and-place tuning, and depaneling damage via router-bit and cushioning fixture redesign.
2. Smart City & Connected Lighting
For smart-city operators and outdoor-lighting OEMs where 97%+test coverage must be achieved without bespoke fixtures or full test specs.
Smart Street-Lighting Multi-Board PCBAs
Connected, intelligent street-lighting modules (e.g., four-board PCBA modules) · Flying Probe Testing for designs with thin or absent test specs · MES traceability per serial.
Builds: PCBA (Multi-Board) · Certifications: IPC-A-610 Class 2/3, RoHS
NEMA Lighting Controllers (Connected, Standard, Photocell)
Connected NEMA Lighting Controllers · Standard NEMA Lighting Controllers · NEMA Photocell Controllers · NEMA socket standard.
Builds:PCBA · Certifications: NEMA socket standard, RoHS
DC Mini Lighting Controllers
Compact DC lighting controllers for low-voltage outdoor lighting systems · Compact form factor with conformal coating and ESD discipline.
Builds: PCBA · Certifications: RoHS
IN PRACTICE
A smart-city street-lighting customer in a developed market gave Indic only Gerbers and a BOM — no test specs, limited test points. Phase1 outsourced MDA reached only ~50% coverage. Indic adopted Flying Probe Testing in Phase 2 and hit 97.78% coverage— without custom fixtures, against the same Gerber + BOM constraints.
Vision, Sensing & Power IoT Modules + Cross-Segment Capabilities
3. Vision, Sensing, HMI & Power IoT Modules
For connected-device platforms requiring HDI camera, motion-sensing modules, HMI interfaces, and IoT power conversion.
HDI Camera & Motion-Sensing Modules
Camera Module PCBAs with high-layer HDI, micro-BGA / fine-pitch BGA, via-in-pad · Motion-sensing boards on 8-layer HDI · Embedded imaging for smart-edge and vision-based devices.
Builds: PCBA (HDI) · Certifications: IPC-A-610 Class 2/3, RoHS
IoT HMI Modules
Connected touch panels and control surfaces · HMI Modules integrated with IoT power and connectivity.
Builds: PCBA · Certifications: RoHS
IoT DC-DC Converters & Motor Controllers
DC-DC Converters for connected-device power conversion · Motor Controller Units for smart appliances and industrial IoT · Power-conversion modules for connected platforms.
Builds: PCBA + Box-Build · Certifications: RoHS, CE
IN PRACTICE
Indic's IoT pillar capability extends beyond placement: router-bit selection by revision, custom depaneling jigs with cushioning, and fixture support tape have all become standard tooling on HDI camera and motion-sensing programs — preventing mechanical damage during depaneling on dense, fragile boards.
4. Certifications & Standards for Connected-Device Manufacturing
5. Supplier Ecosystem & Supporting Capabilities
Schedule a discovery call at indicelectronics.com · or email info@indicelectronics.com to discuss your IoT or smart-device manufacturing program.
