IoT & Smart Devices Manufacturing

Fine-pitch RF, smart-city PCBAs, vision modules, and connectivity electronics

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Connected devices live or die on placement precision. Fine-pitch RF modules with 0.3 mm BGA pitch, multi-board smart-city PCBAs with limited test points, HDI camera and motion-sensing assemblies — all push placement, shielding, and depaneling tolerances to their edge. Indic manufactures IoT and smart-device electronics under a process discipline built specifically for that complexity, with proven outcomes on 0.3 mm pitch, BGA-dense, RF-shielded designs.

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1. Connectivity & RF Modules

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For connected-device OEMs where RF integrity and fine-pitch placement decide field performance.

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Fine-Pitch RF IoT Modules

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RF IoT communication modules  ·  BGA-dense layouts down to 0.3 mm pitch and 01005 passives  · Shielded packages with controlled stencil and reflow profiles.

Builds: PCBA    ·    Certifications: IPC-A-610 Class 2/3, RoHS

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Zigbee Communication Modules & AMI Energy Meters

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Zigbee communication modules for wireless mesh networking  · Zigbee-enabled Smart Energy Meters (AMI)  ·  Energy Meters for utility billing infrastructure.

Builds: PCBA + Box-Build    ·    Certifications: RoHS, BIS-eligible

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BGA-Dense Module Production

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Five or more BGAs per board  ·  Type 5 solder paste with redesigned stencils and support blocks  · Aperture and rheology tuning for fine-pitch yield.

Builds: PCBA (RF)    ·    Certifications: IPC-A-610 Class 2/3

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IN PRACTICE

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For a fast-growing IoT customer backed by a leading silicon provider, Indic solved three coupled manufacturing problems— solder paste printing with Type 5 paste and redesigned stencils, component placement stability via package-level pick-and-place tuning, and depaneling damage via router-bit and cushioning fixture redesign.

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2. Smart City & Connected Lighting

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For smart-city operators and outdoor-lighting OEMs where 97%+test coverage must be achieved without bespoke fixtures or full test specs.

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Smart Street-Lighting Multi-Board PCBAs

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Connected, intelligent street-lighting modules (e.g., four-board PCBA modules) ·  Flying Probe Testing for designs with thin or absent test specs ·  MES traceability per serial.

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Builds: PCBA (Multi-Board)    ·    Certifications: IPC-A-610 Class 2/3, RoHS

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NEMA Lighting Controllers (Connected, Standard, Photocell)

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Connected NEMA Lighting Controllers  ·  Standard NEMA Lighting Controllers  · NEMA Photocell Controllers  ·  NEMA socket standard.

Builds:PCBA    ·    Certifications: NEMA socket standard, RoHS

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DC Mini Lighting Controllers

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Compact DC lighting controllers for low-voltage outdoor lighting systems  · Compact form factor with conformal coating and ESD discipline.

Builds: PCBA    ·    Certifications: RoHS

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IN PRACTICE

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A smart-city street-lighting customer in a developed market gave Indic only Gerbers and a BOM — no test specs, limited test points. Phase1 outsourced MDA reached only ~50% coverage. Indic adopted Flying Probe Testing in Phase 2 and hit 97.78% coverage— without custom fixtures, against the same Gerber + BOM constraints.

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Vision, Sensing & Power IoT Modules + Cross-Segment Capabilities

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3. Vision, Sensing, HMI & Power IoT Modules

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For connected-device platforms requiring HDI camera, motion-sensing modules, HMI interfaces, and IoT power conversion.

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HDI Camera & Motion-Sensing Modules

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Camera Module PCBAs with high-layer HDI, micro-BGA / fine-pitch BGA, via-in-pad  ·  Motion-sensing boards on 8-layer HDI  ·  Embedded imaging for smart-edge and vision-based devices.

Builds: PCBA (HDI)    ·    Certifications: IPC-A-610 Class 2/3, RoHS

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IoT HMI Modules

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Connected touch panels and control surfaces  ·  HMI Modules integrated with IoT power and connectivity.

Builds: PCBA     ·     Certifications: RoHS

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IoT DC-DC Converters & Motor Controllers

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DC-DC Converters for connected-device power conversion  ·  Motor Controller Units for smart appliances and industrial IoT  · Power-conversion modules for connected platforms.

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Builds: PCBA + Box-Build    ·    Certifications: RoHS, CE

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IN PRACTICE

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Indic's IoT pillar capability extends beyond placement: router-bit selection by revision, custom depaneling jigs with cushioning, and fixture support tape have all become standard tooling on HDI camera and motion-sensing programs — preventing mechanical damage during depaneling on dense, fragile boards.

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4. Certifications & Standards for Connected-Device Manufacturing

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5. Supplier Ecosystem & Supporting Capabilities

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Schedule a discovery call at indicelectronics.com ·  or email info@indicelectronics.com to discuss your IoT or smart-device manufacturing program.

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