PCB Assembly Services
INDIC provides end-to-end PCB assembly services from its plant in Bengaluru, India, for OEMs building anything from prototypes to high-volume products. INDIC runs SMT, through-hole, BGA and hybrid assembly on 15 SMT lines, including dual-lane lines, places passives down to 01005 and BGAs down to 0.35 mm pitch, and builds to IPC-A-610 under IATF 16949.
- SMT, THT, BGA and hybrid
- Prototype to high volume
- 01005 to 0.35 mm BGA
- IPC-A-610
| 10.5M+ | PCBs assembled every year |
|---|---|
| 19.5B+ | Components placed every year |
| 15 | SMT lines, including dual-lane lines |
| 01005 | Smallest passive components placed |
| 0.35 mm | Finest BGA pitch assembled |
PCB Assembly Services by Technology and Volume
INDIC offers four assembly technologies and three volume tiers. Most products combine more than one technology.
| Service | Best for | Details |
|---|---|---|
| SMT assembly | Dense, miniaturised boards, with solder paste inspection and 3D AOI | SMT assembly |
| THT assembly | Power components and connectors that need mechanical strength, using wave soldering | THT assembly |
| BGA assembly | BGAs from 10 to 676+ I/O at 0.35 mm to 1.27 mm pitch, with nitrogen reflow, X-ray inspection and rework | BGA assembly |
| Hybrid assembly | Mixed SMT and through-hole builds, finished with conformal coating | Hybrid assembly |
| Low-volume PCBA | Prototypes, pilot runs and niche products with quick turnaround | Low-volume PCBA |
| High-mix PCBA | Many variants in moderate quantities, with fast changeovers | High-mix PCBA |
| High-volume PCBA | Large production runs on automated SMT lines, including dual-lane lines, with 3D SPI and 3D AOI | High-volume PCBA |
Building dense, miniaturised boards? See HDI PCB assembly with fine-pitch BGA.
PCB Assembly Services Capabilities and Specifications
These are INDIC's current PCB assembly capabilities. Items marked 'as a capability' are qualified processes INDIC sets up for a specific program after an engineering review; everything else runs in production today.
| Parameter | Current capability |
|---|---|
| Layer count | Up to 12 layers in production; more than 21 layers as a capability |
| Board types | Rigid and flex circuits, including HDI |
| Board thickness | 32, 64 and 93 mils (about 0.8, 1.6 and 2.4 mm); 125 and 150 mils as a capability |
| Surface finishes | ENIG, immersion tin and HASL; immersion silver and OSP as a capability |
| Via types | Through-hole, blind, buried and micro-vias |
| Smallest passives | 01005, plus every size from 0201 to 1206 |
| Leaded fine pitch (QFP, TSOP) | 25, 20 and 16 mils (about 0.65, 0.5 and 0.4 mm); 12 mils (0.3 mm) as a capability |
| BGA pitch | 0.35 mm, 1 mm and 1.27 mm |
| BGA I/O count | 10 to 676 and above |
| BGA package size | 1.9 × 2.4 mm up to 32 × 32 mm and larger |
| Package-on-package | PoP as a capability |
| SMT processes | Single- and double-sided SMT, paste-in-hole, NeXLev and Mictor connectors |
| Connector lead types | SMT, through-hole and press-fit |
| Assembly lines | 15 SMT lines, including dual-lane lines; THT, BGA and hybrid assembly |
| Reflow soldering | Air and nitrogen reflow |
| Wave soldering | Through-hole and SMT wave soldering; selective fluxing as a capability |
| Flux chemistry and cleaning | No-clean and clean chemistries; Bio Act/IPA cleaning; saponifier and DI-water cleaning as a capability |
| Conformal coating | Acrylic and urethane; silicone as a capability |
| Rework | SRT 1800 rework station, Minipot and in-house developed tooling |
| Failure analysis | In-house, plus third-party laboratories |
| Inspection | 3D SPI, 3D AOI, double-sided AOI, X-ray and first-article inspection, with AOI results in WATS analytics |
| Test | ICT, functional (FCT), end-of-line, hi-pot |
| Workmanship standard | IPC-A-610 |
INDIC runs PCB assembly on world-class SMT, soldering and inspection equipment
INDIC lines use equipment from ASM, Yamaha, Mycronic, Kardex, Heller, Kurtz Ersa, Koh Young, Mirtec and Nikon. The table shows what runs at each stage of the build.
| Process stage | Equipment | What it adds |
|---|---|---|
| Paste inspection | Koh Young 3D SPI | Measures paste volume, height and offset on every pad before placement |
| Placement | ASM and Yamaha placement platforms | Automated, high-speed placement from 01005 passives to large BGAs |
| Reflow | Heller 13-zone nitrogen-ready reflow oven; ERSA Hotflow Three nitrogen reflow | Nitrogen cuts oxygen to ppm levels to stop oxidation, and stable heat transfer gives consistent joints, with up to 25% lower nitrogen use than older systems on the ERSA oven |
| Wave soldering | ERSA Powerflow Pro nitrogen wave; automated wave soldering line | Programmable spray fluxing applies flux only where needed; pallets stay locked until polarity is confirmed, with component verification before each stage |
| AOI | Mirtec 3D AOI; Magic Ray VS300 double-sided AOI | Checks top and bottom in one pass for bridges, blowholes, offset, reverse polarity and bent or missing pins, with results streamed into WATS analytics |
| X-ray | Nikon X-ray | Voids, bridging and head-in-pillow defects under BGA, μBGA and CSP packages |
| First article | Extra Eye | Compares each new board to a golden board, sets up a new program in under a minute and documents every inspection |
| Dispensing | BL-S441 4-axis vision dispensing; LJ-D551 3-axis automated glue dispensing | Camera-guided paths and controlled pressure replace manual gluing with uniform, repeatable volume |
| Line flow | YJ Link SMT gate conveyor | Opens a gap in the line for operator access or maintenance without stopping production |
| Pallet care | Kolb AF30 pallet cleaning | Fully automatic clean, rinse and dry of pallets, carriers, solder masks and condensation filters |
See how this equipment supports HDI PCB assembly and test data traceability.
INDIC offers three component sourcing models
Customers choose how much of the supply chain INDIC manages, backed by 300+ suppliers and dedicated component engineers.
| Model | Who supplies the components | Details |
|---|---|---|
| Full turnkey | INDIC sources every component, manages lead times and alternates, and delivers tested assemblies | Turnkey assembly |
| Partial turnkey | The customer supplies key or controlled parts; INDIC sources the rest and kits the build | Partial turnkey |
| Consigned | The customer supplies all components; INDIC provides assembly, inspection and test | Consigned assembly |
How INDIC Delivers PCB Assembly Services, Step by Step
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DFM review
Engineers review Gerbers and BOM for manufacturability, testability and placement issues before the first build.
Design for excellence -
Sourcing and kitting
Components are procured, verified and kitted, with lifecycle and alternate management.
Component sourcing -
Stencil and paste
Precision stencils and solder paste printing are verified on every board with Koh Young 3D solder paste inspection.
Stencil services -
Placement and soldering
Automated pick-and-place on ASM and Yamaha platforms, nitrogen reflow on Heller and ERSA ovens, and ERSA nitrogen wave soldering for through-hole parts.
Assembly lines -
Inspection
Mirtec 3D AOI on every board with results in WATS, Nikon X-ray for BGAs and hidden joints, and Extra Eye first-article inspection on new builds.
Defect analysis -
Test and ship
In-circuit, functional and end-of-line testing, then packaging and shipment or onward box build.
Testing and quality
INDIC combines certified quality, proven scale and unit-level traceability
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Certified quality
INDIC builds to IPC-A-610 and holds ISO 9001:2015, IATF 16949:2016 and ANSI/ESD S20.20 among 14 certifications. See certifications.
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Proven scale
INDIC assembles more than 10.5 million PCBs and places 19.5 billion components a year across 292K+ sq ft of infrastructure.
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Traceability
INDIC ties test results and component lots to each unit record in SAP Digital Manufacturing, its MES, and streams AOI results into WATS analytics. INDIC reports up to 20% fewer defect escapes from that AOI and WATS integration. See test data traceability.
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Dedicated account management
Every INDIC program has a single point of contact from quote to sustained production. See account management.
INDIC assembles PCBs for seven industry groups
Automotive · E-mobility and EV · Solar · Renewables · Industrial · IoT · Medical, defence and aerospace
PCB assembly services questions
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What PCB assembly services does INDIC offer?
INDIC offers SMT, through-hole, BGA and hybrid PCB assembly, from prototypes and low-volume builds through high-mix to high-volume production. Its PCB assembly services include component sourcing, inspection and testing, with optional box build and wire harness integration.
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What is the smallest component and the largest BGA INDIC can assemble?
INDIC places passives down to 01005. It assembles BGAs from 10 to 676+ I/O at 0.35 mm, 1 mm and 1.27 mm pitch, in packages from 1.9 × 2.4 mm up to 32 × 32 mm and larger.
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Does INDIC offer turnkey PCB assembly?
Yes. INDIC offers full turnkey, partial turnkey and consigned PCB assembly. With full turnkey, INDIC sources every component through 300+ suppliers and delivers finished, tested assemblies.
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Can INDIC build prototypes and low-volume PCB orders?
Yes. INDIC's low-volume and high-mix services support prototypes, pilot runs and niche products with flexible lines and fast changeovers. The same team scales the product to high volume when demand grows.
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How does INDIC inspect and test PCB assemblies?
INDIC uses Koh Young 3D solder paste inspection, Mirtec 3D and Magic Ray double-sided automated optical inspection, Nikon X-ray inspection for hidden joints and Extra Eye first-article inspection. AOI results feed WATS analytics in real time. Testing includes in-circuit, functional, end-of-line and hi-pot, depending on the product.
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What SMT and soldering equipment does INDIC use?
INDIC lines use ASM and Yamaha placement platforms, a Heller 13-zone nitrogen-ready reflow oven, ERSA Hotflow Three reflow and ERSA Powerflow Pro nitrogen wave soldering, plus BL-S441 and LJ-D551 automated dispensing. Inspection runs on Koh Young, Mirtec, Magic Ray, Nikon and Extra Eye equipment.
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How many SMT lines does INDIC run?
INDIC runs 15 SMT lines, including dual-lane lines, alongside through-hole, BGA and hybrid assembly. The lines support everything from prototypes to more than 10.5 million PCBs a year.
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Which quality certifications does INDIC hold?
INDIC builds to IPC-A-610 and holds ISO 9001:2015, IATF 16949:2016, ANSI/ESD S20.20, ISO 14001, ISO 45001 and ISO/IEC 27001, among 14 certifications. The full list is on the INDIC certifications page.
Ready to quote your PCB assembly?
Send INDIC your Gerbers, BOM and target volumes, and its engineers will reply with a manufacturability review, build plan and quote.
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