Manufacturing Capabilities

Assembly line technologies, volume tier capability, and process excellence

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Manufacturing line choice — and the discipline behind it — determines whether a program scales without losing yield. Indic operates a full assembly capability from prototype through HMLV and high-volume programs, across SMT,THT, BGA, and Hybrid lines, with proven process discipline for fine-pitch (0.3 mm, 01005), HDI (>21 layers), and RF assemblies.

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1. Assembly Line Technologies

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For operations and manufacturing leaders choosing assembly technology to match product complexity and volume profile.

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Surface Mount Technology (SMT)

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SMT lines with ERSA Hot flow Three reflow (nitrogen, ~25% lower N2 consumption vs older systems)  · Magic Ray VS 300 single-pass top + bottom AOI ·  Real-time MES auto-scan WIP reporting.

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Builds: PCBA    ·    Certifications: IPC-A-610 Class 2/3

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Through-Hole Technology (THT) & Wave / Selective Soldering

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THT assembly  ·  ERSA Power flow Pro wave soldering  ·  Selective soldering for mixed-tech assemblies  ·  Kolb AF30 pallet cleaner integration.

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Builds: PCBA    ·    Certifications: IPC-A-610 Class 2/3

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BGA & Hybrid Assembly

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BGA assembly across package types (down to 0.35 mm pitch, I/O up to >676,packages >32 × 32 mm)  · Hybrid assembly for complex electronics with diverse technology mix.

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Builds: PCBA (BGA, Hybrid)    ·    Certifications: IPC-A-610 Class 2/3, X-ray verified

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IN PRACTICE

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On a 3 kW 3-wheeler EV charger ARAI program, Indic parallelized PFC top and bottom SMT and prioritized power-board assembly to deliver a 4-day assembly cycle — down from a legacy~2-week cycle — under a 5-day certification window for 10 units.

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2. Volume Tier Capability

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For programs across volume profiles where HMLV change over discipline or high-volume yield stability decides total program cost.

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High-Volume PCBA

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High-volume PCBA services for mature programs with stable demand and frozen designs  ·  Line efficiency, fixture amortization, and process stability at scale.

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Builds: PCBA    ·    Certifications: IATF 16949 where automotive

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Low-Volume PCBA

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Low-volume PCBA for prototypes, custom orders, specialized applications, and pre-production builds  · NPI discipline and engineering support during builds.

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Builds: PCBA    ·    Certifications: IPC-A-610 Class 2/3

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High-MixLow-Volume (HMLV) PCBA

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HMLV PCBA for variant-heavy, engineering-active programs  ·  Changeover discipline, kit-integrity checks, first-article inspection per variant  ·  Continuous engineering support through NPI and ramp.

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Builds: PCBA + Box-Build    ·    Certifications: IPC-A-610 Class 2/3

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IN PRACTICE

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Indic's LVHM operating discipline is the framework that absorbs changeover frequency: front-loaded DFX/DFT, ICT/FCT/EOL coverage matrices, boundary-scan JTAG where access is constrained, golden samples for first-article comparison, kit-integrity checks at every changeover, and NPI pod sprints to absorb engineering changes.

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Process Excellence + Cross-Segment Capabilities

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3. Process Excellence

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For complex assemblies requiring fine-pitch, HDI, and RF process discipline.

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Fine-Pitch & 01005 Component Placement

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Passives down to 01005  ·  BGA pitch 0.35–1.27 mm  ·  Package-level pick-and-place tuning  ·  Special nozzles, support bars, jig tolerance discipline.

Builds: PCBA    ·    Certifications: IPC-A-610 Class 2/3

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HDI & Multi-Layer Boards

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Layers upto >21  ·  Board thickness 32–150 mils  ·  Vias: through, blind, buried, microvia  ·  Finishes: ENIG, immersion tin, HASL, immersion silver, OSP.

Builds: PCBA (HDI)    ·    Certifications: IPC standards

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Solder Paste Printing & Stencil Engineering

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Solder paste handling (incl. Type 5)  ·  Stencil engineering (aperture, rheology, support blocks)  ·  3D solder paste inspection(SPI)  ·  Process validation for fine-pitch and RF programs.

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Builds: PCBA    ·    Certifications: IPC-A-610

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IN PRACTICE

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Indic's manufacturing-process discipline also extends to in-house tooling: an in-house heat-stacking machine developed in-house (manual riveting → automated dual-head PLC/HMI with in-house heating bit) delivered a 90% cost reduction and eliminated supply dependency — commissioned with zero rejections on an 80-piece initial run.

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4. Certifications & Standards Supporting Manufacturing Discipline

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5. Supplier Ecosystem & Supporting Capabilities

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Schedule a discovery call at indicelectronics.com ·  or email info@indicelectronics.com to discuss your manufacturing or volume-scaling program.

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