Manufacturing Capabilities
5
Assembly line technologies, volume tier capability, and process excellence
Manufacturing line choice — and the discipline behind it — determines whether a program scales without losing yield. Indic operates a full assembly capability from prototype through HMLV and high-volume programs, across SMT,THT, BGA, and Hybrid lines, with proven process discipline for fine-pitch (0.3 mm, 01005), HDI (>21 layers), and RF assemblies.
1. Assembly Line Technologies
For operations and manufacturing leaders choosing assembly technology to match product complexity and volume profile.
Surface Mount Technology (SMT)
SMT lines with ERSA Hot flow Three reflow (nitrogen, ~25% lower N2 consumption vs older systems) · Magic Ray VS 300 single-pass top + bottom AOI · Real-time MES auto-scan WIP reporting.
Builds: PCBA · Certifications: IPC-A-610 Class 2/3
Through-Hole Technology (THT) & Wave / Selective Soldering
THT assembly · ERSA Power flow Pro wave soldering · Selective soldering for mixed-tech assemblies · Kolb AF30 pallet cleaner integration.
Builds: PCBA · Certifications: IPC-A-610 Class 2/3
BGA & Hybrid Assembly
BGA assembly across package types (down to 0.35 mm pitch, I/O up to >676,packages >32 × 32 mm) · Hybrid assembly for complex electronics with diverse technology mix.
Builds: PCBA (BGA, Hybrid) · Certifications: IPC-A-610 Class 2/3, X-ray verified
IN PRACTICE
On a 3 kW 3-wheeler EV charger ARAI program, Indic parallelized PFC top and bottom SMT and prioritized power-board assembly to deliver a 4-day assembly cycle — down from a legacy~2-week cycle — under a 5-day certification window for 10 units.
2. Volume Tier Capability
For programs across volume profiles where HMLV change over discipline or high-volume yield stability decides total program cost.
High-Volume PCBA
High-volume PCBA services for mature programs with stable demand and frozen designs · Line efficiency, fixture amortization, and process stability at scale.
Builds: PCBA · Certifications: IATF 16949 where automotive
Low-Volume PCBA
Low-volume PCBA for prototypes, custom orders, specialized applications, and pre-production builds · NPI discipline and engineering support during builds.
Builds: PCBA · Certifications: IPC-A-610 Class 2/3
High-MixLow-Volume (HMLV) PCBA
HMLV PCBA for variant-heavy, engineering-active programs · Changeover discipline, kit-integrity checks, first-article inspection per variant · Continuous engineering support through NPI and ramp.
Builds: PCBA + Box-Build · Certifications: IPC-A-610 Class 2/3
IN PRACTICE
Indic's LVHM operating discipline is the framework that absorbs changeover frequency: front-loaded DFX/DFT, ICT/FCT/EOL coverage matrices, boundary-scan JTAG where access is constrained, golden samples for first-article comparison, kit-integrity checks at every changeover, and NPI pod sprints to absorb engineering changes.
Process Excellence + Cross-Segment Capabilities
3. Process Excellence
For complex assemblies requiring fine-pitch, HDI, and RF process discipline.
Fine-Pitch & 01005 Component Placement
Passives down to 01005 · BGA pitch 0.35–1.27 mm · Package-level pick-and-place tuning · Special nozzles, support bars, jig tolerance discipline.
Builds: PCBA · Certifications: IPC-A-610 Class 2/3
HDI & Multi-Layer Boards
Layers upto >21 · Board thickness 32–150 mils · Vias: through, blind, buried, microvia · Finishes: ENIG, immersion tin, HASL, immersion silver, OSP.
Builds: PCBA (HDI) · Certifications: IPC standards
Solder Paste Printing & Stencil Engineering
Solder paste handling (incl. Type 5) · Stencil engineering (aperture, rheology, support blocks) · 3D solder paste inspection(SPI) · Process validation for fine-pitch and RF programs.
Builds: PCBA · Certifications: IPC-A-610
IN PRACTICE
Indic's manufacturing-process discipline also extends to in-house tooling: an in-house heat-stacking machine developed in-house (manual riveting → automated dual-head PLC/HMI with in-house heating bit) delivered a 90% cost reduction and eliminated supply dependency — commissioned with zero rejections on an 80-piece initial run.
4. Certifications & Standards Supporting Manufacturing Discipline
5. Supplier Ecosystem & Supporting Capabilities
Schedule a discovery call at indicelectronics.com · or email info@indicelectronics.com to discuss your manufacturing or volume-scaling program.
